Thermal pad /thermal gap filler pad/thermal conductive pad
Applications:
- Between electronic components such as Semiconductor, IC, CPU, MOS and heatsink.
- Led Lighting, LCD TV, Telecom device, Wireless Hub, Power supply etc.
- Cooling Modules, Thermal modules, in all applications where a metal housing is used as heatsink.
Specification Sheet:
|
|
| Properties |
Units |
Metric Value |
Test Method |
| Construction & Composition |
---- |
Silicone & Fiberglass |
---- |
| Color |
---- |
white |
Visual |
| Thickness Range |
mm |
0.3~10 |
---- |
| Hardness |
Shore C |
A 15~35 |
ASTM D2240 |
| Density |
g/cc |
1.8±0.1 |
ASTM D792 |
| Tensile Strength |
Kgf/cm2 |
>180 |
ASTM D412 |
| Elongation |
% |
60% |
ASTM D412 |
| Continuous Use Temp |
°C |
-40 to 220 |
EN344 |
| Breakdown Voltage |
Kv/mm |
?4.0 |
ASTM D149 |
| Volume Impedance |
ohm-cm |
1.0*1011 |
ASTM D257 |
| Dielectric Constant |
1MHz |
5.27 |
ASTM D150 |
| Weight Damnify |
---- |
?1 |
@150°C 240H |
| Flame Rating |
---- |
V-0 |
UL 94 |
| Thermal Conductivity |
W/m.k |
1.2±0.2 |
ASTM E1461 |
| UL, RoHS, REACH |
---- |
Compliance |
---- |
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